Company's Profile
Amkor Technology, Inc. is a provider of outsourced semiconductor packaging and test services. The Company's packaging and test services are designed to meet application and chip-specific requirements, including the required type of interconnect technology; size; thickness; and electrical, mechanical, and thermal performance. It provides turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level, and final test and drop shipment services. It refers to its flip chip, wafer-level processing, and related test services as Advanced Products and its wire-bond packaging, power device packaging, and related test services as Mainstream Products. Its Advanced Products include flip chip scale packages, wafer-level packages, and flip chip ball grid array (FCBGA) packages. Its Mainstream Products include lead frame packages, substrate-based wire bond packages, and micro-electro-mechanical systems (MEMS) packages.